SK Hynix to participate in TSMC's OIP 2024

South Korean chipmaker SK Hynix Inc. will participate in the Open Innovation Platform (OIP) Ecosystem Forum hosted by Taiwan's TSMC, the world's largest foundry company, to showcase its AI memory solutions.

According to industry sources on Friday, TSMC will hold the OIP Ecosystem Forum 2024 next Wednesday at the Santa Clara Convention Center in California, where it will discuss the latest technologies and products with its partners and clients.

Since 2008, TSMC has supported the OIP with intellectual property (IP) companies, electronic design automation (EDA) firms, and design houses, providing fabless companies with semiconductor designs optimized for TSMC's production process.

At this year's event, TSMC will highlight how AI transforms chip design and discuss the latest advancements in 3D integrated circuit (IC) system design. There will also be over 50 technical presentations and 47 exhibitions by OIP ecosystem partners.

SK Hynix, a partner of TSMC, will present joint research on 2.5D systems within packages to improve the quality and reliability of high-bandwidth memory (HBM).

The company will also have a booth showcasing its latest AI memory products, including the fifth-generation HBM3E, LPCAMM2, and GDDR7.

In addition, representatives from companies like Nvidia, Microsoft, AMD, Arm, Cadence and Synopsys will deliver technical presentations.

The OIP Forum will be held in six regions, including the US, Japan, Taiwan, China, Europe, and Israel, with participation from 750 companies and over 6,000 attendees expected.

Write to Jeong-Soo Hwang at hjs@hankyung.com