bufferless HBM4
Scope
Date
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Korean chipmakers
Samsung Electronics, TSMC tie up for HBM4 AI chip development
TAIPEI – South Korea’s Samsung Electronics Co., the world’s largest memory chipmaker, is partnering with its foundry rival Taiwan ...
4 HOURS AGO
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Korean chipmakers
Samsung to mass-produce HBM4 on 4 nm foundry process
Samsung Electronics Co., the world’s top memory chipmaker, plans to use its cutting-edge 4-nanometer (nm) foundry process for the mass product...
Jul 15, 2024 (Gmt+09:00)
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Korean chipmakers
HBM chip war intensifies as SK Hynix hunts for Samsung talent
South Korean chipmaker SK Hynix Inc., just like its global peers, has largely designed and produced semiconductors in-house, including high-bandwidt...
Jul 08, 2024 (Gmt+09:00)
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Korean chipmakers
Samsung to launch 3D HBM chip packaging service in 2024
SAN JOSE -- Samsung Electronics Co. will launch three-dimensional (3D) packaging services for high-bandwidth memory (HBM) within the year, a te...
Jun 16, 2024 (Gmt+09:00)
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Korean chipmakers
Samsung showcases HBM3E DRAM, automotive chips
SILICON VALLEY -- Samsung Electronics Co. on Friday showcased a number of new-concept, next-generation DRAM chips, including the industry’s mo...
Oct 21, 2023 (Gmt+09:00)
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Korean chipmakers
Samsung Elec to launch HBM4 in 2025 to win war in AI sector
Samsung Electronics Co., the world’s top memory chipmaker, aims to introduce sixth-generation top-performance High Bandwidth Memory4 (HBM4) DR...
Oct 10, 2023 (Gmt+09:00)