Samsung Elec showcases new high-performance graphics DRAM

Samsung Electronics Co., the world’s top memory chipmaker, unveiled a next-generation graphics DRAM to meet growing demand for high-performance products amid rapid growth in the global metaverse sector.

The South Korean tech giant said on Tuesday that it has developed GDDR6W with higher bandwidth and capacity.

Samsung built the graphics DRAM by applying fan-out wafer-level packaging (FOWLP) technology for the first time in the industry to the existing GDDR6 to ramp up memory bandwidth and capacity. GDDR6W doubles the bandwidth and capacity of GDDR6 while maintaining the exact same size. 

That allowed the industry to reduce the area required for memory by 50%, compared to previous models, Samsung said.

FOWLP technology directly mounts memory die on a silicon wafer, instead of a printed circuit board (PCB), enabling much finer wiring patterns.

The technology also cut the thickness of the package and improves heat dissipation as it does not use PCB. The height of the FOWLP-based GDDR6W is 0.7 mm – 36% slimmer than the previous package.

"With GDDR6W, we're able to foster differentiated memory products that can satisfy various customer needs – a major step toward securing our leadership in the market," said a Samsung executive.

Write to Sungsu Bae at baebae@hankyung.com
Jongwoo Cheon edited this article.