Solus to supply copper foil for AI accelerators to Nvidia

Solus Advanced Materials, a South Korean copper foil supplier, will provide copper foil for AI accelerators to Nvidia, a leading company in artificial intelligence (AI) chips.

According to industry sources on Monday, the company received final mass production approval from Nvidia.

It will supply its high-end hyper very low profile (HVLP) copper foil to Doosan Electronics BG, a copper-clad laminate (CCL) manufacturer.

Solus Advanced Materials' HVLP copper foil is expected to be used in Nvidia's next-generation AI accelerators, scheduled for release this year.

HVLP copper foil is designed to minimize the signal loss in electronic products by reducing surface roughness to less than 0.6 micrometers (one millionth of a meter).

Due to its ability to reduce signal loss, HVLP copper foil can be used in AI accelerators, 5G communications equipment, and network substrate materials for high-efficiency signal transmission.

Solus Advanced Materials is reportedly the first South Korean company to supply copper foil for AI accelerators to Nvidia.

The company has received approval from Intel for copper foil products for next-generation AI accelerators and performance testing is underway at AMD.

Write to Woo-Sub Kim at duter@hankyung.com