Hanmi Semiconductor wins $16 mn HBM equipment order from SK Hynix
Jeong-Soo Hwang
Mar 22, 2024 (Gmt+09:00)
South Korean chip equipment company Hanmi Semiconductor Co. announced on Friday that it has secured a 21.5 billion won ($16.1 million) supply deal for its third-generation artificial intelligence (AI) semiconductor high-bandwidth memory (HBM) hypermodel "dual TC bonded griffin" with SK Hynix Inc., the world’s second-largest memory chipmaker.
The company had received orders from SK Hynix amounting to 101.2 billion won in the second half of last year and 86 billion won in February.
It surpasses a cumulative total of 200 billion won in orders by this month. This is the largest order volume since its founding.
"Hanmi Semiconductor has applied for 109 bonding equipment patents to date and is producing dual TC bonders based on its outstanding technological capabilities and know-how," the Vice President of Hanmi Semiconductor Kwak Dong-shin said.
"It is anticipated that Hanmi Semiconductor will achieve its target sales of 450 billion won ($337 million) this year."